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USER’S MANUAL
Revision 1.0
SuperWorkstation®
740P-TR
740P-TRT
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in industrial environment for Class A device or in residential
environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with
radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in
which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See ”.www.dtsc.ca.gov/hazardouswaste/perchlorate
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0
Release Date: June 03, 2021
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2021 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
3
Preface
Preface
About this Manual
This manual is written for professional system integrators and PC technicians. It provides
information for the installation and use of the server. Installation and maintenance should be
performed by experienced technicians only.
Please refer to the 740P-TR/TRT server specications page on our website for updates on
supported memory, processors and operating systems (http://www.supermicro.com).
Notes
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: https://www.supermicro.com/wdl
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
If you have any questions, please contact our support team at:
support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
Secure Data Deletion
A secure data deletion tool designed to fully erase all data from storage devices can be found
on our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wdl/utility/
Lot9_Secure_Data_Deletion_Utility/
Warnings
Special attention should be given to the following symbols used in this manual.
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
4
Preface
Contents
Chapter 1 Introduction
1.1 Overview ...............................................................................................................................9
1.2 System Features ................................................................................................................10
Front View .........................................................................................................................10
Control Panel .................................................................................................................11
Rear View ..........................................................................................................................12
1.3 System Architecture ...........................................................................................................13
Printed Circuit Boards .......................................................................................................13
1.4 Motherboard Layout ...........................................................................................................14
Quick Reference Table ......................................................................................................15
Motherboard Block Diagram .............................................................................................17
Chapter 2 Server Installation
2.1 Overview .............................................................................................................................18
2.2 Unpacking the System .......................................................................................................18
2.3 Preparing for Setup ............................................................................................................18
Choosing a Setup Location ...............................................................................................18
Rack Precautions ..............................................................................................................19
Server Precautions ............................................................................................................19
Workstation Precautions ...................................................................................................19
Rack Mounting Considerations .........................................................................................20
Ambient Operating Temperature ....................................................................................20
Airow ............................................................................................................................20
Mechanical Loading .......................................................................................................20
Circuit Overloading ........................................................................................................20
Reliable Ground .............................................................................................................20
2.4 Preparing the Chassis ........................................................................................................22
2.5 Installing the Rails ..............................................................................................................23
2.6 Installing the Server into the Rack .....................................................................................28
2.7 Control Panel Orientation ...................................................................................................31
Chapter 3 Maintenance and Component Installation
3.1 Removing Power ...............................................................................................................33
3.2 Accessing the System ........................................................................................................34
3.3 Processor and Heatsink .....................................................................................................35
5
Preface
Prepare the System ..........................................................................................................35
ESD Precautions ...............................................................................................................35
Installation Overview .........................................................................................................36
Removal Overview ............................................................................................................36
Heatsink Overview ............................................................................................................37
Create the Processor Carrier Assembly ...........................................................................38
Create the Processor Heatsink Module (PHM) ................................................................40
Prepare the Socket ...........................................................................................................41
Install the PHM ..................................................................................................................42
Remove the PHM from the Motherboard ..........................................................................44
Remove the Carrier Assembly from the Heatsink ............................................................45
Remove the Processor from the Carrier Assembly ..........................................................46
3.4 Memory ...............................................................................................................................47
DDR4 Memory Support for the 3rd Gen Intel Xeon Scalable Processors ....................47
Memory Population Table for the 3rd Gen Intel Xeon Scalable ....................................48
PMem 200 Series Population table for X12DP Motherboards (with 18 Slots)Note: The
Intel® OptaneTM Persistent Memory (PMem) 200 Series are supported by the 3rd Gen
Intel Xeon Scalable (83xx/63xx/53xx/4314 Series) Processors. ...................................49
DIMM Installation ..............................................................................................................51
DIMM Removal .................................................................................................................51
3.5 Motherboard Battery ...........................................................................................................52
3.6 Storage Drives ....................................................................................................................53
PCI Expansion Card Installation .......................................................................................56
3.7 System Cooling ..................................................................................................................58
Fan Failure ........................................................................................................................58
Air Shroud .........................................................................................................................60
3.8 Power Supply .....................................................................................................................61
Power Supply Indicators ................................................................................................61
3.9 Cable Routing Diagram ......................................................................................................62
3.10 BMC Reset ........................................................................................................................63
Chapter 4 Motherboard Connections
4.1 Power Connections ............................................................................................................64
4.2 Headers and Connectors ...................................................................................................65
Control Panel .................................................................................................................69
Front Control Panel LEDs .................................................................................................70
6
Preface
4.3 Input/Output Ports ..............................................................................................................73
Rear I/O Ports ................................................................................................................73
4.4 Jumpers ..............................................................................................................................77
4.5 LED Indicators ....................................................................................................................79
Chapter 5 Software
5.1 Microsoft Windows OS Installation .....................................................................................81
5.2 Driver Installation ................................................................................................................83
5.3 SuperDoctor® 5 ...................................................................................................................84
5.4 BMC ....................................................................................................................................85
BMC ADMIN User Password ............................................................................................85
Chapter 6 Optional Components
6.1 Optional Parts List ..............................................................................................................86
6.2 Additional Storage ..............................................................................................................87
Conguring the 5.25" Drive Bays ......................................................................................87
6.3 Intel Virtual RAID on CPU (VROC) ....................................................................................90
Requirements and Restrictions .........................................................................................90
Supported SSDs and Operating Sytems ..........................................................................90
Additional Information .......................................................................................................91
Hardware Key ...................................................................................................................91
Enabling NVMe RAID........................................................................................................92
Status Indications ..............................................................................................................94
Hot-Swap Drives ...............................................................................................................94
Hot-unplug .....................................................................................................................94
Hot-plug .........................................................................................................................94
Chapter 7 Troubleshooting and Support
7.1 Information Resources .......................................................................................................95
Website .............................................................................................................................95
Direct Links for the 740P-TR/TRT System ....................................................................95
Direct Links for General Support and Information .......................................................95
7.2 Intelligent Platform Management Interface (IPMI) .............................................................96
7.3 Troubleshooting Procedures .............................................................................................97
No Power ..........................................................................................................................97
No Video ...........................................................................................................................98
System Boot Failure .........................................................................................................98
Memory Errors ..................................................................................................................99
7
Preface
Losing the System's Setup Conguration .........................................................................99
When the System Becomes Unstable ..............................................................................99
7.4 BIOS Error Beep (POST) Codes .....................................................................................101
Additional BIOS POST Codes ........................................................................................101
7.5 Crash Dump Using IPMI ..................................................................................................102
7.6 UEFI BIOS Recovery .......................................................................................................103
Overview .........................................................................................................................103
Recovering the UEFI BIOS Image ..................................................................................103
Recovering the Main BIOS Block with a USB Device ....................................................103
7.7 CMOS Clear .....................................................................................................................108
7.8 Where to Get Replacement Components ........................................................................109
7.9 Reporting an Issue ...........................................................................................................109
Technical Support Procedures ........................................................................................109
Returning Merchandise for Service .................................................................................109
Vendor Support Filing System ........................................................................................110
7.10 Feedback .........................................................................................................................110
Appendix A Standardized Warning Statements for AC Systems
Appendix B System Specications
8
Preface
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
9
Chapter 1: Introduction
Chapter 1
Introduction
1.1 Overview
This chapter provides a brief outline of the functions and features of the SuperServer
740P-TR/TRT. It is based on the X12DPi-N(T)6 motherboard and the CSE-745BTS-R1K23BP
chassis.
The following provides an overview of the specications and capabilities.
System Overview
Processor
Support Dual 3rd Gen Intel Xeon Scalable Processors
Memory
Supports up to 4 TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory
with speeds of 3200/2933/2666 MHz in 18 memory slots and up to 4 TB of Intel Optane PMem 200
Series with speeds of up to 3200 MHz. See for more details.Chapter 3
Drive Support Eight hot-swappable 3.5" SATA drive bays, two optional xed SATA or NVMe drives, one optional DVD
drive
Expansion Slots
Two PCIe 4.0 p9-x8 slots (CPU1 Slot1/CPU2 Slot6)
Four PCIe 4.0 x16 slots (CPU1 Slot2/CPU1 Slot3/CPU2 Slot4/CPU2 Slot5)
One PCIe 4.0 p9-x4 M.2 slot (supports M-Key 2280 and 22110)
Networking
Two 10G Ethernet LAN ports supported by Intel X550 for X12DPi-NT6
Two 1G Ethernet LAN ports supported by Intel i350 for X12DPi-N6
One Dedicated IPMI LAN located on the rear I/O panel (via AST2600 BMC)
I/O Ports
One rear serial COM port, one onboard serial COM header
Eight I-SATA 3.0 ports, four S-SATA 3.0 ports, two S-SATA 3.0 ports with SuperDOM
One rear VGA port, one onboard VGA header
Four rear USB 3.0 ports, one onboard USB 2.0 header with two connections, one onboard USB 3.0
header with two connections, one onboard USB 2.0 Type-A header
System Cooling
Two rear heavy-duty hot-swappable fans
Three internal 8-cm hot-swappable fans
One air shroud
Power Two 1200W Redundant Titanium Level Power Supplies
Form Factor 2U (WxHxD) 16.8 x 3.5 x 25.5 in. (427 x 89 x 648 mm)
Notes: A Quick Reference guide can be found on the product page of the Supermicro
website. The following safety models associated with the 740P-TR/TRT have been certied
as compliant with CSA or UL models: 745BT-R12X12 and 745-12.
10
Chapter 1: Introduction
System Features: Front
Feature Description
Control Panel Front control panel with LEDs and buttons. See the following page.
5.25" Drive Bays Two 5.25" drive bays can be used to support optional xed SATA or NVMe drives
DVD Drive Optional DVD drive
3.5" Hard Drive Bays Eight hot-swap drive bays behind locking bezel
Lock Front bezel lock
Feet Removable feet (when using system in a 4U rackmount conguration)
Drive Indicators Eight pairs of LED status indicators for drives
Service Tag Pull-out service tag with BMC password label
1.2 System Features
The CSE-745BTS-R1K23BP is a tower chassis that can also be congured as a 4U rackmount.
The following views of the system display the main features.
Front View
Figure 1-1. Front View
Control Panel
5.25" Drive Bay
5.25" Drive Bay
3.5" Drive Bays
Feet
Optional DVD Drive
Lock
Drive LED Indicators
11
Chapter 1: Introduction
Control Panel Features
Feature Description
Power Button The main power switch applies or removes primary power from the power supply to the server
but maintains standby power.
Reset Button Use the reset button to reboot the system.
Power LED Indicates power is being supplied to the system power supply units. This LED is illuminated
when the system is operating normally.
HDD LED Indicates activity on the storage drives when ashing.
NIC LED Indicates network activity on LAN1 when ashing.
NIC LED Indicates network activity on LAN2 when ashing.
Information LED Universal information LED (see table below for details).
Power Fail LED Indicates one of the redundant power modules has failed when ashing.
USB Front accessible USB 3.0 connector
USB Front accessible USB 3.0 connector
Control Panel
Figure 1-2. Control Panel
Information LED
Status Description
Continuously on and red An overheat condition has occurred.
Blinking red (1Hz) Fan failure, check for an inoperative fan.
Solid blue Local UID has been activated. Use this function to locate the server in a rackmount
environment.
Blinking blue Remote UID is on. Use this function to identify the server from a remote location.
Power
Power LED
HDD LED
NIC LED
Reset
NIC LED
Information LED
Power Failure LED
USB
12
Chapter 1: Introduction
Rear View
Figure 1-3. System: Rear View
System Features: Rear
Feature Description
Top Cover Lock Top cover locking mechanism
Power Supplies Two 1000W redundant power supplies
Fans Two rear heavy-duty hot-swappable fans
Networking Two 10G ports and one 1G dedicated BMC LAN port
USB Four rear USB 3.0 ports
COM One rear serial COM port
VGA One rear VGA port
Power Supply
Fan
Fan
Power Supply
Top Cover Lock
COM
USB
Dedicated BMC LAN
LAN
VGA
1
3
2
4
5
6
Expansion Slot Locations
Item DescriptionSlot Name
1SLOT1 PCIe 4.0 p12-x8 slot (CPU1)
2,3SLOT2, SLOT3 PCIe 4.0 x16 slot (CPU1)
4,5SLOT4, SLOT5 PCIe 4.0 x16 slot (CPU2)
6SLOT6 PCIe 4.0 p12-x8 slot (CPU2)
13
Chapter 1: Introduction
1.3 System Architecture
This section covers the printed circuit board (PCB) locations.
Printed Circuit Boards
Figure 1-4. PCB Locations
Backplane
Motherboard
14
Chapter 1: Introduction
Figure 1-5. Motherboard Layout
1.4 Motherboard Layout
Below is a layout of the X12DPi-N(T)6 motherboard with jumper, connector and LED locations
shown. See the table on the following page for descriptions. For detailed descriptions, pinout
information and jumper settings, refer to Chapter 4 Motherboard Manual. or the
C
MAC CODE
BIOS
LICENSE
IPMI CODE
JS3 JS1
BMC
BMC
Firmware
BIOS
JM2_1
JF1
LAN1LAN2
FAN3FAN4
JUSBRJ45
JNCSI
JUIDB1
FANB
FANA
FAN6
FAN2FAN1
JPI2C1
LE4
LE6
JRK1
(Front) VGA
LEDM1
JBT1
JSTBY1
JPL1 JPME1JIPMB1
JNVI2C
JPWR4
JPWR1 JPWR2
S-SGPIO
SATA5
SATA6
JPWR3
JPCIE1
JLAN2
JLAN1
UID LED
JS2
M.2 Slot
TPM/Port80
PCH
LED
PWR
BMC Heartbeat LED
IPMI_LAN/USB7/8(3.0)
P1_NVME2/3
P1_NVME0/1
I-SATA0~3 I-SATA4~7
USB6(3.0) USB4/5(3.0)
USB2/3
(3.0)
USB0/1
(2.0)
S-SATA4S-SATA5
S-SATA0~3
VGA
COM2
COM1
CMOS CLEAR
UID
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCI-E 4.0 X8
CPU1 SLOT2 PCI-E 4.0 X16
CPU1 SLOT3 PCI-E 4.0 X16
CPU2 SLOT4 PCI-E 4.0 X16
CPU2 SLOT5 PCI-E 4.0 X16
CPU2 SLOT6 PCI-E 4.0 X8
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
LE3
JL1
BAR CODE
VROC
JVGA
JFP2
LAN CTRL2
JTPM-1
RAID KEY-1
Front Panel CTRL
P2-DIMMB2
P1-DIMMB2
CPLD
FAN5
REV:1.00
X12DPi-N(T)6
LAN CTRL1
(*X12DPI-N6)
X12DPI-NT6
BT1
Battery
JPWR4
P2-DIMMC1
JF1
JPWR2
LE3
JPWR3
JPWR1
P2-DIMMD1
P2-DIMMA1
P2-DIMMB1
P2-DIMMG1
P2-DIMMH1
P2-DIMME1
P2-DIMMF1
JIPMB1
USB6 (3.0)
M.2
JPL1
JL1
COM2
JPME1
Battery
S-SGPIO
S-SATA0-3
JNVI2C
USB0/1 (2.0)
USB4/5 (3.0)
LE4
BIOS
JTPM1
I-SATA0-3
I-SATA4-7
(Front) VGA
(JFP2)
Clear CMOS
LE6 IPMI_LAN
USB7/8(3.0)
LAN2
USB2/3(3.0)
LAN1
COM1
VGA
FAN5
FAN4
FANA
VROC(JRK1)
NVME2/3
S-SATA4
JNCSI
UID
FAN2
JPI2C1
Slot4
LEDM1
Slot3
Slot1
FANB
JSTBY1
Slot6
LANCTRL2 (X12DPi-6N)
FAN6
Slot5
Slot2
S-SATA5
NVME0/1
FAN3
P1-DIMMG1
P1-DIMMF1
P1-DIMMH1
P1-DIMME1
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
P1-DIMMD1
FAN1
P1-DIMMB2
P2-DIMMB2
LANCTRL1 (X12DPi-6NT)
15
Chapter 1: Introduction
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS Clear Open (Normal)
JPL1 LAN Enable/Disable Pins 1-2 (Enabled)
JPME1 ME Manufacturing Recovery Pins 1-2 (Normal)
LED Description Status
LE3 Power LED LED On: Onboard Power On
LE4 M.2 LED Blinking Green: Device Working
LE6 Unit Identier (UID) LED Solid Blue: Unit Identied
LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal (Active),
Solid Green: (During BMC Reset or during a Cold Reboot)
Connector Description
Battery (BT1) Onboard battery
COM1 Rear I/O COM port
COM2 Front Accessible COM port header
FAN1 - FAN6, FANA, FANB CPU/System fan headers
BMC_LAN Dedicated BMC LAN port
JF1 Front Control Panel header
JIPMB1 4-pin BMC external I2C header
JL1 Chassis Intrusion header
JNCSI NC-SI (Network Controller Sideband Interface) connector (See Note below)
JNVI2C NVMe I2C header
JPI2C1 Power System Management Bus (SMB) I2C header
JPWR2/JPWR4 8-pin power connectors
JPWR3 24-pin ATX power connector
JSTBY1 Standby power header
JTPM1 Trusted Platform Module/Port 80 connector
LAN1, LAN2 Ethernet LAN (RJ45) Port 1/ Port 2 (1G LAN support on X12DPi-N6 and 10G LAN support
on X12DPi-NT6)
M.2 PCIe 4.0 p15-x4 M.2 slot (with support of M-Key 2280, and 22110)
MH15, MH16 Mounting holes for M.2 keys (MH15: for M.2 Key 2280, MH16: for M.2 Key 22110)
P1_NVME0/1, P1_NVME2/3 PCIe 4.0 p15-x8 SlimSAS ports with support of four NVMe connections (0/1, 2/3)
I-SATA 0-3, I-SATA 4-7 Intel® PCH SATA 3.0 ports (with RAID 0, 1, 5, 10)
S-SATA 0-3 Intel® PCH S-SATA 3.0 ports (with RAID 0, 1, 5, 10)
S-SATA4/S-SATA5 Intel PCH powered S-SATA 3.0 ports with support for SuperDOM (Disk on Module) devices
SLOT1 PCIe 4.0 p15-x8 slot supported by CPU1
SLOT2/SLOT3 PCIe 4.0 x16 slots supported by CPU1
SLOT4, SLOT5 PCIe 4.0 x16 slots supported by CPU2
16
Chapter 1: Introduction
SLOT6 PCIe 4.0 x8 slot supported by CPU2
S-SGPIO Serial Link General Purpose I/O connection header (for S-SATA4/5 SuperDOM support)
USB0/1 (2.0) Front-accessible USB header with support for two USB 2.0 ports
USB2/3, USB7/8 (3.0) Rear I/O USB 3.0 ports
USB4/5 (3.0) Front-accessible USB header with support for two USB 3.0 ports
USB6 Internal Type A USB 3.0 port
UID LED/BMC Reset (JUIDB1) Unit Identier (UID) LED & BMC Reset switch
VGA (JFP2) Front VGA header
VGA (JVGA) Rear VGA port on the I/O back panel
VROC (JRK1) Intel VROC key header for NVMe RAID support (See Note below.)
17
Chapter 1: Introduction
Figure 1-8. Motherboard Block Diagram
Motherboard Block Diagram
PCIe X8
12~15
0~7PCIe X8 G4
PCIe X4 G4
SLOT 1
USB 2.0
M.2
PCIe X4
8~11
8~15
0~7
JNVME1
USB 2.0
#10
DDR4
P1
DDR4
2666/2933/3200
2666/2933/3200
DMI2
CPU2-E1
#8
SlimSAS
PCIe GEN4 X16
R FS- -CGTL8211 VS
DDR4
#14
#1
PCIe GEN4 X16
#1
CPU2-G1
P2
SlimSAS
CPLD
(PFR)
DDR4
PCIe X16
DDR4
PCIe TWO X4 G4
DDR4
2666/2933/3200
CPU1-A1
DDR4
2666/2933/3200
SPI
#3
PCIe GEN4 X16
PCIe X1 G2
DMI2
2666/2933/3200
2666/2933/3200
#0
#5
#4
PCIe GEN4 X16
CPU1-C1
#3
BIOS
#2
#2
2666/2933/3200
SPI
DDR4
PCIe GEN4 X16
PCIe GEN4 X8
P0
SLOT 5
ESPI
DDR4
CPU1-F1
DDR4
PCIe X16 G4
PCIe TWO X4 G4
SATA
PCH
X12DPi-N(T)6
#11
SLOT 6
PECI:31
#12
#1
L 3 ( C )AN To MM
W83773G *2 (RT1/RT2)
2666/2933/3200
2666/2933/3200
PCIe X16
DDR4
CPU2-C1
BMC
PCIe X8 G4
CPU2-F1
SPI
CPU1
CPU2-A1
UPI
SPI
2666/2933/3200
PCIe GEN4 X16
#0
#5
PCIe X16 G4
CPU2-D1
RGRMII
2666/2933/3200
CPU2-H1
AST 0260
#10 USB2.0
DMI2
PCIe X16 G4
0~7
CPU1-G1
DDR4
2666/2933/3200
DDR4
2666/2933/3200
PCIe X16 G4
PCIe X8
USB 3.0
CPU2
#13
SLOT 4
2666/2933/3200
CPU1-E1
CPLD
FLASH
BMC B t Fl hoo as
DDR4
2666/2933/3200
DMI X4
USB
Temperature Sensor
UPI
CPU1-D1
6.0 Gb/S
#2
SPI
CPU1-H1
#6
#3
DDR4
PCIe X16
#7
SLOT 2
SLOT 3
P0
SATA0-2
SSATA0
TPM HE ERAD
DDR4
#9
DDR4
Debug Card
DDR4
2666/2933/3200
CPU1-B
1
CPU2-B1
DDR4
PCIe X16
USB
LAN CTRL1
X550 (
10G LAN)
JNVME2
PCIe X4 G4
(Socket ID:0) (Socket ID:1)
PECI:30
UPI
P2
P1
CPU1-B2
CPU2-B2
LAN CTRL2
i 0 (35
1G LAN)
(*
for X12DPi-N6
)
(*
for X12DPi-NT6
)
Reserved for Optane
PMem 200 Series*
Reserved for Optane
PMem 200 Series*
18
Chapter 2: Server Installation
Chapter 2
Server Installation
2.1 Overview
This chapter provides advice and instructions for mounting your system in a server rack.
If your system is not already fully integrated with processors, system memory etc., refer to
Chapter 3 for details on installing those specic components.
Caution: Electrostatic Discharge (ESD) can damage electronic components. To prevent such
damage to PCBs (printed circuit boards), it is important to use a grounded wrist strap, handle
all PCBs by their edges and keep them in anti-static bags when not in use.
2.2 Unpacking the System
Inspect the box in which the SuperServer 740P-TR/TRT was shipped, and note if it was
damaged in any way. If any equipment appears damaged, le a damage claim with the carrier
who delivered it.
Decide on a suitable location for the rack unit that will hold the server. It should be situated
in a clean, dust-free area that is well ventilated. Avoid areas where heat, electrical noise and
electromagnetic elds are generated. It will also require a grounded AC power outlet nearby.
Be sure to read the precautions and considerations noted in Appendix A.
2.3 Preparing for Setup
The box in which the system was shipped should include the rackmount hardware needed to
install it into the rack. Please read this section in its entirety before you begin the installation.
Choosing a Setup Location
• The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas
where heat, electrical noise and electromagnetic elds are generated.
• Leave enough clearance in front of the rack so that you can open the front door completely
(~25 inches) and approximately 30 inches of clearance in the back of the rack to allow
su󰀩cient space for airow and access when servicing.
• This product should be installed only in a Restricted Access Location (dedicated equipment
rooms, service closets, etc.).
19
Chapter 2: Server Installation
• This product is not suitable for use with visual display workplace devices according to §2
of the German Ordinance for Work with Visual Display Units.
Rack Precautions
• Ensure that the leveling jacks on the bottom of the rack are extended to the oor so that
the full weight of the rack rests on them.
• In single rack installations, stabilizers should be attached to the rack. In multiple rack in-
stallations, the racks should be coupled together.
• Always make sure the rack is stable before extending a server or other component from
the rack.
• You should extend only one server or component at a time - extending two or more simul-
taneously may cause the rack to become unstable.
Server Precautions
• Review the electrical and general safety precautions in Appendix A.
• Determine the placement of each component in the rack you install the rails.before
• Install the heaviest server components at the bottom of the rack rst and then work your
way up.
• Use a regulating uninterruptible power supply (UPS) to protect the server from power
surges and voltage spikes and to keep your system operating in case of a power failure.
• Allow any drives and power supply modules to cool before touching them.
• When not servicing, always keep the front door of the rack and all covers/panels on the
servers closed to maintain proper cooling.
Workstation Precautions
• Ensure that the caster wheels on the workstation are locked.
• Review the electrical and general safety precautions in Appendix A.
• Use a regulating uninterruptible power supply (UPS) to protect the workstation from power
surges, voltage spikes and to keep your system operating in case of a power failure.
• Allow the power supply units and hot-swap SATA drives to cool before touching them.
20
Chapter 2: Server Installation
• To maintain proper cooling, always keep all chassis panels closed and all SATA carriers
installed when not being serviced.
Rack Mounting Considerations
Ambient Operating Temperature
If installed in a closed or multi-unit rack assembly, the ambient operating temperature of the
rack environment may be higher than the room's ambient temperature. Therefore, make sure
the rack's ambient temperature does not exceed the manufacturer’s maximum rated ambient
temperature (TMRA).
Airow
Equipment should be mounted into a rack so that the amount of airow required for safe
operation is not compromised.
Mechanical Loading
Equipment should be mounted into a rack so that a hazardous condition does not arise due
to uneven mechanical loading.
Circuit Overloading
Consideration should be given to the connection of the equipment to the power supply circuitry
and the e󰀨ect that any possible overloading of circuits might have on overcurrent protection
and power supply wiring. Appropriate consideration of equipment nameplate ratings should
be used when addressing this concern.
Reliable Ground
A reliable ground must be maintained at all times. To ensure this, the rack itself should be
grounded. Particular attention should be given to power supply connections other than the
direct connections to the branch circuit (i.e. the use of power strips, etc.).
21
Chapter 2: Server Installation
To prevent bodily injury when mounting or servicing this unit in a rack, you must take
special precautions to ensure that the system remains stable. The following guidelines
are provided to ensure your safety:
• This unit should be mounted at the bottom of the rack if it is the only unit in the rack.
• When mounting this unit in a partially lled rack, load the rack from the bottom to the top
with the heaviest component at the bottom of the rack.
• If the rack is provided with stabilizing devices, install the stabilizers before mounting or
servicing the unit in the rack.
• Slide rail mounted equipment is not to be used as a shelf or a work space.
Warning: Do not pick up the server with the front handles. They are designed to pull
the system from a rack only.
Slide rail mounted equipment is not to be used as a shelf or a work space.
22
Chapter 2: Server Installation
2.4 Preparing the Chassis
Removing the Top Tower Cover
1. Locate the blue cover lock at the rear of the cover.
2. Slide the lock to the right and push the cover forward.
3. Lift the top cover o󰀨 the chassis.
Figure 2-1. Removing the Top Tower Cover and Feet
Removing the Chassis Feet
1. Lay the chassis on its side.
2. Remove the screws holding the chassis feet in place.
3. Each foot has a foot lock tab at the center. Use a at head screwdriver to gently lift the
foot lock upward. Slide the foot toward the rear of the chassis.
23
Chapter 2: Server Installation
2.5 Installing the Rails
This section provides a guideline for installing the rails to the chassis and to the rack with
the included rackmount kit.
Identifying the Sections of the Rack Rails
The optional rackmount kit includes two rack rail assemblies. Figures 2-2 and 2-3 show the
sections of one rail assembly from two dierent angles.
Middle rail
Rail brackets
Figure 2-2. Rack Rail Sections (Outer View)
Inner rail
Outer rail
Inner rail
Outer rail
Middle rail
Figure 2-3. Rack Rail Sections (Inner View)
Rail bracket
24
Chapter 2: Server Installation
Assembling the Outer Rails and the Rack Brackets
Each outer rail requires assembly with the rack brackets before mounting onto the rack.
1. Identify the two long brackets for the rear of each rail and the two short brackets for the
front of each rail. The brackets are also left and right specic.
2. Secure the short bracket onto the outer rail with screws at the side as shown below.
3. Place the long bracket onto the outer rail at the approximate position to t your rack.
Use two or three screws. Leave the screws just loose enough for the bracket to slide
back and forth slightly.
Note: The short bracket is secured rmly to the rail. However, the long bracket is slightly loose.
Figure 2-4. Assembling the Outer Rails
2
3
25
Chapter 2: Server Installation
Releasing the Inner Rail from the Outer Rail
1. Locate the rail assembly.
2. Extend the rail assembly by pulling it outward.
3. Press the quick-release tab.
4. Separate the inner rail from the outer rail assembly.
Figure 2-5. Releasing the Inner Rail (Outer View)
1
2
3
4
26
Chapter 2: Server Installation
Figure 2-6. Installing the Handles and Inner Rails to the Chassis
Installing the Inner Rails to the Chassis
1. Attach the handles to the front of the chassis with three screws each.
2. Identify the left and right inner rails. They are labeled on the rails and in the gure
below.
3. Align each rail with the screw holes along the side of the chassis.
4. Screw the rails securely to the side of the chassis.
Screw for Handles
Screw for Inner Rails
Figure 2-7. Handles and Inner Rails Installed to the Chassis
1
1
L
R
4
27
Chapter 2: Server Installation
Installing the Outer Rails to the Rack
Use the previously assembled outer rails with the rear brackets loosely attached.
1. Adjust the outer rail to t the rack depth. Align the screw holes in the bracket ears with
the holes in the rack post.
2. Use screws and fasteners to secure the outer rails to the front and rear rack posts.
3. Tighten the screws holding the rear bracket.
Figure 2-9. Installing the Outer Rails to the Rack
Bracket ear
Bracket ear
Figure 2-8. Installing the Outer Rails to the Rack
1
3
1
2
28
Chapter 2: Server Installation
Note: Figure is for illustrative purposes only. Always install servers to the bottom of a rack rst.
Figure 2-10. Installing the Server into the Rack
2.6 Installing the Server into the Rack
With rails attached to both the chassis and the rack, install the server into the rack.
1. Pull the middle rail out of the outer rail and make sure the ball bearing shuttle is locked
at the front of the middle rail.
2. Align the chassis rails with the rack rails. Slide the chassis rails into the rack rails until
the server is completely in the rack (see the next page).
29
Chapter 2: Server Installation
Warning: Stability hazard. The rack stabilizing mechanism must be in place, or the
rack must be bolted to the oor before you slide the unit out for servicing. Failure to
stabilize the rack can cause the rack to tip over.
When initially installing the server to a rack, test that the rail locking tabs engage to
prevent the server from being overextended. Have a rack lift in place as a precaution
in case the test fails.
Figure 2-11. Securing the Server to the Rack
Note: Figure is for illustrative purposes only. Always install servers to the bottom of a rack rst.
3. Insert and tighten the thumbscrews that hold the front of the server to the rack.
30
Chapter 2: Server Installation
Warning: In any instance of pulling the system from the rack, always use a rack lift
and follow all associated safety precautions.
Removing the Chassis from the Rack
Caution! It is dangerous for a single person to o-load the heavy chassis from the rack without
assistance. Be sure to have sucient assistance supporting the chassis when removing it
from the rack. Use a lift.
1. Remove the screws that hold the front of the server to the rack.
2. Pull the chassis forward out the front of the rack until it stops.
3. Find the quick-release tab on each side of the chassis on the inner rails. Press down on
the quick-release tab and continue to pull the chassis out of the rack.
Slide rail mounted equipment is not to be used as a shelf or a work space.
31
Chapter 2: Server Installation
2.7 Control Panel Orientation
The server can be congured for either tower or server rack orientation. It is shipped in tower
mode and can be immediately used as desktop server. To use it in a rack, rotate the module
that contains the control panel and the three drive trays ( in Figure 2-12) 90 degrees.
Figure 2-12. Chassis in Tower Mode (Default Conguration)
Default Hard
Disk Drive Bays
5.25" Drive Trays
Control Panel
Control Panel/
Drive Module
Figure 2-13. Chassis in Rackmount Mode
Control Panel/
Drive Module
1
1
1
32
Chapter 2: Server Installation
Figure 2-14. Rotating the Control Panel/Drive Module
Rotating the Control Panel/Drive Module for Rack Mounting
1. Power down pen the chassis cover the system and o.
2. Disconnect any cables from the back of the Control Panel/Drive Module.
3. Push the module release lever to unlock the module.
Module Release Lever
Control Panel/
Drive Module
in Rack Mount
Orientation
3
4. Grasp the edges of the module and pull it from the chassis.
5. Rotate the module 90 degrees so that the control panel is on top.
6. Reinsert the module into the chassis and reconnect the cables.
Caution: Use caution when working around the backplane. Do not touch the module
backplane with any metal objects and make sure no ribbon cables touch the backplane or
obstruct the holes, which aid in proper airow.
33
Chapter 3: Maintenance and Component Installation
Chapter 3
Maintenance and Component Installation
This chapter provides instructions on installing and replacing main system components. To
prevent compatibility issues, only use components that match the specications and/or part
numbers given.
Installation or replacement of most components require that power rst be removed from the
system. Please follow the procedures given in each section.
3.1 Removing Power
Use the following procedure to ensure that power has been removed from the system.
1. Use the operating system to power down the system.
2. After the system has completely shut-down, disconnect the AC power cords from the
power strip or outlet.
3. Disconnect the power cords from the power supply modules.
34
Chapter 3: Maintenance and Component Installation
3.2 Accessing the System
The CSE-745BTS-R1K23BP has removable side and front covers for interior access.
Removing the Side Cover
1. Begin by from the system.removing power
2. Push the cover latch button to release the latch handle.
3. Pull the cover o the chassis using the latch handle.
Warning: Except for short periods of time, do not operate the server without the cover in place.
The chassis cover must be in place to allow for proper airow and to prevent overheating.
Figure 3-1. Removing the Side Cover
Side Cover
Cover Latch
Handle
Cover Latch
Button
Removing the Front Cover
The front cover houses up to eight hot-swappable hard drives. The cover can be locked to
prevent unauthorized access. The key to this lock is shipped with the system.
1. Unlock the front cover using the key shipped with the system.
2. Holding the key in the lock, swing the front cover open.
35
Chapter 3: Maintenance and Component Installation
3.3 Processor and Heatsink
Prepare the system for processor and heatsink installation or removal. Follow the static-
sensitive device precautions when working with the processor and heatsink.
Prepare the System
1. Remove power from the system.
2. Remove the chassis cover and any components that are obstructing the CPU socket.
3. Check that the plastic protective cover is on the CPU socket and that none of the socket
pins are bent. If they are, contact your retailer.
4. Refer to the Supermicro website for updates on processor and memory support.
Note: All graphics in this manual are for illustration only. Your components may look dierent.
ESD Precautions
Electrostatic Discharge (ESD) can damage electronic com ponents. Handle the motherboard
carefully. The following measures are generally sucient to protect your equipment from ESD.
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the motherboard from the antistatic bag.
• Handle the motherboard by its edges only; do not touch its components, peripheral chips,
memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or the socket, and may require manufacturer repairs.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your computer chassis provides excellent conduc-
tivity between the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of onboard CMOS battery. Do not install the onboard battery
upside down to avoid possible explosion.
36
Chapter 3: Maintenance and Component Installation
Installation Overview
After preparing the system and following ESD precautions, there are four steps to installing
the processor and heatsink onto the motherboard.
1. Attach the processor to a plastic carrier to create the processor carrier assembly.
2. Attach the processor carrier assembly to the heatsink to create the processor heatsink
module (PHM).
3. Prepare the socket for PHM installation.
4. Install the PHM.
Removal Overview
After preparing the system and following ESD precautions, there are three steps to removing
the processor and heatsink from the motherboard.
1. Remove the PHM from the motherboard.
2. Remove the processor carrier assembly from the heatsink.
3. Remove the processor from the carrier.
37
Chapter 3: Maintenance and Component Installation
Figure 3-2. Heatsink SNK-P0078P
(for CPU1)
Heatsink Overview
The 740P-TR/TRT server uses the same heatsink (SNK-P0078P) for both CPU1 and CPU2.
Note: Thermal grease is pre-applied on new heatsinks. No additional thermal grease is
needed.
Figure 3-3. Heatsink SNK-P0078P
(for CPU2)
38
Chapter 3: Maintenance and Component Installation
Create the Processor Carrier Assembly
Process Carrier Assembly
1. Hold the processor with the gold pins (LGA lands) facing down. Locate the gold triangle
at the corner of the processor and the corresponding hollowed triangle on the processor
carrier as shown below. These triangles indicate the location of pin 1.
Latch
Latch
Processor (Reverse Side Up)
Carrier (Top Side Up)
CPU Key
CPU Key
Latch
Latch
Pin 1
Pin 1
2. Turn the processor over (with the gold pins up). Locate the CPU keys on the processor
and the four latches on the carrier as shown below.
Processor Carrier
39
Chapter 3: Maintenance and Component Installation
1
2A
B Latch
Latch
a
CPU Key (on the
processor)
CPU Key (on the
carrier)
CPU Key (on the
processor)
CPU Key (on
the carrier) b
5. Once aligned, carefully place one end of the processor under latch 1 on the carrier, and
then press the other end down until it snaps into latch 2.
Processor Carrier Assembly
(Top Side View)
Processor Carrier Assembly
3. Locate the lever on the processor socket and press it down as shown below.
4. Using pin 1 as a guide, carefully align the CPU keys on the processor (A & B) with
those on the carrier (a & b) as shown below.
Lever
40
Chapter 3: Maintenance and Component Installation
Processor Carrier Assembly
Pin1
A
B
C
D
a
b
c
d
Heatsink
Create the Processor Heatsink Module (PHM)
If necessary, apply the proper amount of thermal grease to the underside of the heatsink.
Processor Heatsink Module
1. Turn the heatsink over with the thermal grease facing up. Pay attention to the two
triangle cutouts (A, B) located at the diagonal corners of the heatsink as shown in the
drawing below.
2. Hold the processor carrier assembly upside-down to locate the triangles on the
processor and the carrier, which indicate pin 1.
3. Turn the processor carrier assembly over so that the gold pins are facing up. Locate the
two pin 1 locations ("A" on the processor and "a" on the processor carrier assembly).
4. Align "a" on the processor carrier assembly with the triangular cutout "A" on the heatsink
along with "b", "c", "d" on the processor assembly with "B", "C", "D" on the heatsink.
5. Once properly aligned, place the heatsink on the processor carrier assembly with all
corners matched up, making sure that the four clips are properly securing the heatsink.
41
Chapter 3: Maintenance and Component Installation
Prepare the Socket
Remove the plastic protective cover on the socket by gently squeezing the grip tabs and
pulling the cover o󰀨.
CPU Socket with Plastic Protective Cover
Grip Tab
42
Chapter 3: Maintenance and Component Installation
d
a
b
c
A, B, C, D: Peek Nut
1, 2, 3, 4: Rotating Wire
a, b, c, d: Threaded Fastener
Peek Nut
(Unlatched) (latched)
Rotating Wire 3
Peek Nut
A
B
C
D
Rotating Wire 1
2
Rotating Wire
Rotating Wire 4
Threaded Fastener
Heatsink
CPU Socket
a
b
c
d
(a, b, c, d: Threaded Fasteners) CPU Socket Pin1
Threaded FastenerCPU Socket
Install the PHM
After assembling the Processor Heatsink Module (PHM), you are ready to install it into the
CPU socket.
1. Locate four threaded fasteners (a, b, c, d) on the CPU socket.
2. Locate four peek nuts (A, B, C, D) and four rotating wires (1, 2, 3, 4) on the heatsink as
shown below.
3. Check the rotating wires (1, 2, 3, 4) to make sure that they are in the unlatched position
as shown.
43
Chapter 3: Maintenance and Component Installation
a, b, c, d:
Threaded Fastener on the CPU socket
A, B, C, D:
Peek Nut on the Heatsink
A
B
C
D
a
b
c
d
4. Align peek nut "A" (next to the trianglular pin 1 on the heatsink) with threaded fastener
"a" on the CPU socket. Then align peek nuts "B", "C", "D" on the heatsink with threaded
fasteners "b", "c", "d" on the CPU socket, making sure that all peek nuts and threaded
fasteners are properly aligned.
5. Once aligned, gently place the heatsink on the CPU socket, making sure that each peek
nut is properly attached to its corresponding threaded fastener.
Rotating Wire Rotating Wire
6. Press all four rotating wires outward and make sure that the heatsink is securely latched
into the CPU socket.
C
D
A
B
7. With a t30-bit screwdriver, tighten all peek nuts in the sequence of "A", "B", "C", and
"D" with even pressure. To avoid damaging the processor or socket, do not use a force
greater than 12 lbf-in when tightening the screws.
8. Examine all corners of the heatsink to ensure that the PHM is rmly attached to the
CPU socket.
44
Chapter 3: Maintenance and Component Installation
Remove the PHM from the Motherboard
Before removing the PHM from the motherboard, rst shut down the system and unplug the
AC power cord from all power supplies.
1. Use a t30-bit screwdriver to loosen the four peek nuts on the heatsink in the sequence
of A, B, C, and D.
A
B
C
D
Peek Nut
2. Once the peek nuts have been loosened from the CPU socket, press the rotating wires
inward to unlatch the PHM from the socket as shown below.
3. Gently lift the PHM upward to remove it from the CPU socket.
45
Chapter 3: Maintenance and Component Installation
Remove the Carrier Assembly from the Heatsink
To remove the processor carrier assembly from the PHM, please follow the steps below:
1. Detach the four plastic clips (marked a, b, c, d) on the processor carrier assembly from
the four corners of the heatsink (marked A, B, C, D) as shown below.
2. When all plastic clips have been detached from the heatsink, remove the processor
carrier assembly from the heatsink
Pin1 Pin1
A
B
C
D
a
b
c
dProcessor Carrier Assembly
Heatsink
46
Chapter 3: Maintenance and Component Installation
Remove the Processor from the Carrier Assembly
Once you have removed the processor carrier assembly from the PHM, you are ready to
remove the processor from the processor carrier by following the steps below.
1. Unlock the lever from its locked position and push it upwards to disengage the
processor from the processor carrier as shown below right.
Lever
Processor Carrier Assembly
2. Once the processor has been loosened from the carrier, carefully remove the processor
from the carrier.
Note: Please handle the processor with care to avoid damaging it or its pins.
47
Chapter 3: Maintenance and Component Installation
3.4 Memory
The X12DPi-N(T)6 supports up to 4TB 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4
(288-pin) ECC memory with speeds of 3200/2933/2666MHz in 16 DIMM slots and up to 4TB
of Intel Optane PMem 200 Series with speeds of up to 3200MHz in two additional slots. (See
the notes below.)
Notes: The Intel® OptaneTM Persistent Memory (PMem) 200 Series are supported by the 3rd
Gen Intel Xeon Scalable (83xx/63xx/53xx/4314 Series) Processors. P1-DIMMB2/P2-DIMMB2
memory slots are reserved for Intel Optane PMem 200 Series only. Memory speed support
depends on the processors used in the system.
DDR4 Memory Support for the 3rd Gen Intel Xeon Scalable Processors
DDR4 Memory Support for the 3rd Gen Intel Xeon Scalable Processors
Type Ranks Per DIMM &
Data Width
DIMM Capacity (GB)
Speed (MT/s); Voltage (V);
Slots Per Channel (SPC) and DIMMs Per Channel (DPC)
1DPC
(1-DIMM Per Chan-
nel)
2DPC
(2-DIMM Per Channel)
8Gb 16Gb 1.2 V 1.2 V
RDIMM
SRx8 8GB 16GB
3200 3200
SRx4 16GB 32GB
DRx8 16GB 32GB
DRx4 32GB 64GB
RDIMM 3Ds (4R/8R) X4 2H- 64 GB
4H-128 GB
2H- 128 GB
4H-256 GB
LRDIMM QRx4 64GB 128GB 3200 3200
LRDIMM - 3Ds (4R/8R) X4 4H-128 GB 2H- 128 GB
4H-256 GB 3200 3200
Key Parameters for DIMM Congurations
Parameters Possible Values
Number of Channels 8
Number of DIMMs per Channel 1DPC (1 DIMM Per Channel) or 2DPC (2 DIMMs Per Channel)
DIMM Type RDIMM (w/ECC), 3DS RDIMM, LRDIMM, 3DS LRDIMM
DIMM Construction non-3DS RDIMM Raw Cards: A/B (2Rx4), C (1Rx4), D (1Rx8), E (2Rx8)
3DS RDIMM Raw Cards: A/B (4Rx4)
non-3DS LRDIMM Raw Cards: D/E (4Rx4)
3DS LRDIMM Raw Cards: A/B (8Rx4)
48
Chapter 3: Maintenance and Component Installation
Memory Population Table for the 3rd Gen Intel Xeon Scalable
Memory Population for the X12 DP Motherboard, 18 DIMM Slots
CPUs/DIMMs Memory Population Sequence
1 CPU & 1 DIMM A1
1 CPU & 2 DIMMs* A1, E1
1 CPU & 4 DIMMs* A1, E1, C1, G1
1 CPU & 6 DIMM A1, E1, C1, G1, B1, F1
1 CPU & 8 DIMMs* A1, E1, C1, G1, B1, F1, D1, H1
1 CPU & 9 DIMMs* A1, E1, C1, G1, B1, F1, D1, H1, B2 (B2: Reserved for PMem 200 Series only)
2 CPUs & 2 DIMMs* CPU1: A1
CPU2: A1
2 CPUs & 4 DIMMs* CPU1: A1, E1
CPU2: A1, E1
2 CPUs & 6 DIMMs CPU1: A1, E1, C1, G1
CPU2: A1, E1
2 CPUs & 8 DIMMs* CPU1: A1, E1, C1, G1
CPU2: A1, E1, C1, G1
2 CPUs & 10 DIMMs CPU1: A1, E1, C1, G1, B1, F1
CPU2: A1, E1, C1, G1
2 CPUs & 12 DIMMs* CPU1: A1, E1, C1, G1, B1, F1
CPU2: A1, E1, C1, G1, B1, F1
2 CPUs & 14 DIMMs CPU1: A1, E1, C1, G1, B1, F1, D1, H1
CPU2: A1, E1, C1, G1, B1, F1
2 CPUs & 16 DIMMs* CPU1: A1, E1, C1, G1, B1, F1, D1, H1
CPU2: A1, E1, C1, G1, B1, F1, D1, H1
2 CPUs & 18 DIMMs CPU1: A1, E1, C1, G1, B1, F1, D1, H1, B2 (B2: Reserved for PMem 200 Series only)
CPU2: A1, E1, C1, G1, B1, F1, D1, H1, B2 (B2: Reserved for PMem 200 Series only)
Note 1: P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane™ PMem 200 Series
only.
Note 2: To maximize memory performance, please use the memory congurations marked
with "*" above (also shaded in orange) as these congurations are recommended by
Supermicro for optimal memory performance.
49
Chapter 3: Maintenance and Component Installation
PMem 200 Series Population table for X12DP Motherboards (with 18 Slots)
Note: The Intel® OptaneTM Persistent Memory (PMem) 200 Series are supported by the
3rd Gen Intel Xeon Scalable (83xx/63xx/53xx/4314 Series) Processors.
Validation Matrix (DDR4 DIMMS with PMem 200 Series)
DIMM Type
Ranks Per DIMM
& Data Width
(Stack)
DIMM Capacity (GB)
DRAM Density
8Gb 16Gb
RDIMM
(up to 3200)
1Rx8 N/A N/A
1Rx4 16GB 32GB
1Rx8 16GB 32GB
1Rx4 32GB 64GB
RDIMM 3DS
(up to 3200)
4Rx4 (2H) N/A 128GB
8Rx4 (4H) NA 256GB
LRDIMM (up to 3200) 4Rx4 64GB 128GB
LRDIMM 3DS
(up to 3200)
4Rx4 (2H) N/A N/A
8Rx4 (4H) 128GB 256GB
Legend (for the table above)
DDR4 Type and Capacity
DDR4 See Validation Matrix (DDR4 DIMMs validated with PMem)
Capacity
PMem Any Capacity (Uniformly for all channels for a given conguration)
• Mode denitions: AD = App Direct Mode, MM = Memory Mode.
• No mixing of PMem and NVDIMMs within the platform.
• For MM, NM/FM ratio is between 1:4 and 1:16. (NM = Near Memory (DRAM); FM = Far Memory (PMem)).
• Matrix targets congs for optimized PMem to DRAM cache ratio in MM mode.
• For each individual population, di󰀨erent PMem rearrangements among channels are permitted so long as the
conguration doesn’t break X12DP Memory population rules.
• Ensure the same DDR4 DIMM type and capacity are used for each DDR4 + PMem population.
• If the system detects an unvalidated conguration, then the system issues a BIOS warning. The CLI functionality is
limited in non-POR congurations, and select commands will not be supported.
PMem 200 Series Population Table for X12DP 18-DIMM Motherboards (within 1 CPU socket)
DDR4+PMem Mode AD
Interleave
P1-
DIMMF1
P1-
DIMME1
P1-
DIMMH1
P1-
DIMMG1
P1-
DIMMC1
P1-
DIMMD1
P1-
DIMMA1
P1-
DIMMB2
P1-
DIMMB1
4+4 AD
MM
One - x4 -PMem PMem PMemDDR4 DDR4 DDR4 DDR4 PMem
One - x4 -DDR4 DDR4 DDR4PMem PMem PMem PMem DDR4
6+1 AD One - x1
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4-PMem -
- -DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 PMem
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem - -
PMem DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 - -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4-PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4-PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem - -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem - -
8+1 AD One - x1 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem
50
Chapter 3: Maintenance and Component Installation
C
MAC CODE
BIOS
LICENSE
BMC CODE
JS3 JS1
BMC
BMC
Firmware
BIOS
JM2_1
JF1
LAN1LAN2
FAN3FAN4
JUSBRJ45
JNCSI
JUIDB1
FANB
FANA
FAN6
JPI2C1
LE4
LE6
JRK1
(Front) VGA
JBT1
JSTBY1
JPME1JIPMB1
JNVI2C
JPWR4
JPWR2
S-SGPIO
SATA5
SATA6
JPWR3
JLAN2
JLAN1
UID LED
JS2
M.2 Slot
TPM/Port80
PCH
LED
PWR
BMC Heartbeat LED
BMC_LAN/USB7/8(3.0)
P1_NVME2/3
P1_NVME0/1
I-SATA0~3 I-SATA4~7
USB6(3.0) USB4/5(3.0)
USB2/3
(3.0)
USB0/1
(2.0)
S-SATA4S-SATA5
S-SATA0~3
VGA
COM2
COM1
CMOS CLEAR
UID/BMC
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCIe 4.0 X8
CPU1 SLOT2 PCIe 4.0 X16
CPU1 SLOT3 PCIe 4.0 X16
CPU2 SLOT4 PCIe 4.0 X16
CPU2 SLOT5 PCIe 4.0 X16
CPU2 SLOT6 PCIe 4.0 X8
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
LE3
JL1
BAR CODE
VROC
JVGA
JFP2
LAN CTRL2
JTPM-1
RAID KEY-1
Front Panel CTRL
P2-DIMMB2
P1-DIMMB2
CPLD
FAN5
REV:1.00
X12DPi-N(T)6
LAN CTRL1
(*X12DPI-N6)
X12DPI-NT6
BT1
Battery
Reset
MH15 MH16
NVME
JPL1
LEDM1
P2-DIMMC1
P2-DIMMD1
P2-DIMMA1
P2-DIMMB1
P2-DIMMB2
P1-DIMMG1
P1-DIMMF1
P1-DIMMH1
P1-DIMME1
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
P1-DIMMD1
P1-DIMMB2
Figure 3-4. DIMM Slots
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
P2-DIMMG1
51
Chapter 3: Maintenance and Component Installation
DIMM Installation
1. Insert the desired number of DIMM modules based on the recommended DIMM
population table on page 48.
2. Align the DIMM module key with the receptive point on the single-latch DIMM slot.
Receptive Point
Release Tab
Notch
Push both ends straight
down into the memory slot.
3. Push the release tab outwards to unlock the slot.
4. Press both ends of the module straight down into the slot until the module snaps into
place.
5. Push the release tab to the lock position to secure the module into the slot.
DIMM Removal
Reverse the steps above to remove the DIMM modules from the motherboard.

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Varumärke: Supermicro
Kategori: Server
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