Intel Celeron M 360 Bruksanvisning
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Document Number: 303110-008
Intel® Celeron® M Processor
on 90 nm Process
Datasheet
January 2007
2 Datasheet
IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS
OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING
TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for
use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Celeron® M processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Δ
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See www.intel.com/products/processor_number for details.
Intel, Celeron, MMX, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
*Other names and brands may be claimed as the property of others.
Copyright© 2004–2007, Intel Corporation. All rights reserved.
Datasheet 3
Contents
1 Introduction ..............................................................................................................7
1.1 Terminology .......................................................................................................8
1.2 References .........................................................................................................8
2 Low Power Features ................................................................................................ 11
2.1 Clock Control and Low Power States .................................................................... 11
2.1.1 Normal State ......................................................................................... 11
2.1.2 AutoHALT Power-Down State ................................................................... 11
2.1.3 Stop-Grant State.................................................................................... 11
2.1.4 HALT/Grant Snoop State ......................................................................... 12
2.1.5 Sleep State ........................................................................................... 12
2.1.6 Deep Sleep State ................................................................................... 13
2.2 FSB Low Power Enhancements............................................................................ 13
2.3 Processor Power Status Indicator (PSI#) Signal..................................................... 14
3 Electrical Specifications ........................................................................................... 15
3.1 Power and Ground Pins ...................................................................................... 15
3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 15
3.2 Voltage Identification and Power Sequencing ........................................................ 15
3.3 Catastrophic Thermal Protection .......................................................................... 17
3.4 Signal Terminations and Unused Pins ................................................................... 17
3.5 FSB Frequency Select Signals (BSEL[1:0])............................................................ 17
3.6 FSB Signal Groups............................................................................................. 17
3.7 CMOS Signals ................................................................................................... 19
3.8 Maximum Ratings.............................................................................................. 19
3.9 Processor DC Specifications ................................................................................ 19
4 Package Mechanical Specifications and Pin Information .......................................... 29
4.1 Processor Pinout and Pin List .............................................................................. 37
4.2 Alphabetical Signals Reference ............................................................................ 55
5 Thermal Specifications and Design Considerations .................................................. 63
5.1 Thermal Specifications ....................................................................................... 65
5.1.1 Thermal Diode ....................................................................................... 65
5.1.2 Thermal Diode Offset.............................................................................. 66
5.1.3 Intel® Thermal Monitor........................................................................... 67
Produktspecifikationer
| Varumärke: | Intel |
| Kategori: | Processor |
| Modell: | Celeron M 360 |
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