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Intel Solid State-enheter (ssd) DCP3600

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Order Number: 330569-002 US
Intel® Solid-State Drive DC P3600 Series
Product Specification
 Capacities:
400GB 800GB, 1.2TB, 1 TB, 2TB , .6
PCIe* Gen3 X4
Form Factors
– 2.5-inch Form Factor
15mm Z-height
8639-compatible connector
– AIC Form Factor
Half-height, Half-length
Single slot p1-x4 connector
Performance1,2
– Seq R/W: Up to 26 1700MB/s00/ 3
– IOPS Rnd 70/30 R/W 4KB4: Up to 160K
– IOPS Rnd 4KB4 R/W: Up to 450/ K 56
– Seq Latency (typ) R/W: 20/20µs
Components
– Intel® 20nm MLC NAND Flash Memory
Operating System Support:
– Windows* Server 2012 R2 , , 2012
2008 R2 x64
– RHEL* 6.5, 7.0
– UEFI 2.3.1
Reliability
– Uncorrectable Bit Error Rate (UBER):
1 sector per 1017 bits read
– Mean Time Before Failure (MTBF):
2 million hours
– T10 DIF protection
– Variable Sector Size: 512, 520, 528,
4096, 4104, 4160, 4224 Bytes
Powe r
– 2.5-inch: 3.3V and 12V Supply Rail
– AIC: 3.3V and 12V Supply Rail
– Enhanced power-loss data protection
– Active/Idle (TYP): Up to 25W/4W (TYP)
Compliance
– NVM Express* 1.0
– PCI Express Base Specification Rev 3.0
– Enterprise SSD Form Factor Version 1.0a
– PCI Express Card Electro-Mechanical
( ) Specification Rev 2.0 CEM
Certifications and Declarations
– UL*, CE*, C-Tick*, BSMI*, KCC*,
Microsoft WHQL*, VCCI *
En rance Rating du
– Up to 10.95 PBW (Petabytes Written)5
3 Drive Writes/day (JESD219 workload)
Temperature Specification
– Operating:
AIC: 0 to 55° C with specified airflow
2.5-inch: 0 to 35° C ambient,
0 to 70° C case with specified airflow
– Non-Operating6: -55 to 95° C
– Temperature monitoring (In-band and by
way of SMBUS)
– Thermal throttling
Airflow
– AIC (55° C airflow towards IO bracket7)
400 GB: 100 LFM
800GB/1.2TB/ 6TB/2.0TB: 300 LFM 1.
– 2.5-inch (Airflow towards the connector)
400 50/GB: 2 300 LFM (25/35° C)
800GB: 350/500 LFM (25/35° C)
1.2TB/ 6 /2.0TB 1. TB :
450/650 LFM (25/35° C)
Weight
AIC: 400/800GB up to 185gm
1.2TB, 1.6TB, 2TB up to 195gm
2.5-inch: 400/800GB up to 115 gm
1.2TB, 1.6TB, 2TB up to 125gm
Shock
– 2.5-inch: 1,000 G/0.5msec
– AIC: 50 G Trapezoidal, 170 in/s
Vibration
– Operating: 2. G17 RMS (5-700Hz)
– Non-Operating: 3.13 GRMS -800Hz) (5
Altitude (Simulated)
– Operating -1,000 to 10,000 ft :
– Non-Operating: -1,000 to 40,000 ft
Product Ecological Compliance
– RoHS
1. Performan value vary by capacity and form factorce s
2. Performance specifications apply to both compressible and incompressible data
3. MB/s = 1,000,000 bytes/second
4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes
5. 1PB = 1015 Bytes
6. Please contact your Intel representative for details on the non-operating temperature range
7. Airflow out of server through PCIe Card Slot
Product Specification 2014 July
2 330569-002 US
Ordering Information
Contact your local Intel sales representative for ordering information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CON-DITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY
APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
This document contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling 1- - -4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel 800 548
Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others. Copyright © 2014 Intel Corporation. All rights reserved.
Intel® Solid-State Drive DC P3600 Series
July 2014 Product Specification
330569-002 3 US
Contents
1 Overview ..................................................................................................................... 7
1.1 References ................................................................................................................... 8
1.2 Terms and Acronyms ..................................................................................................... 9
2 Product Specifications ...................................................................................................10
2.1 Capacity ..................................................................................................................... 10
2.2 Performance ................................................................................................................ 10
2.3 Electrical Characteristics ............................................................................................... 12
2.4 Environmental Conditions ............................................................................................. 13
2.5 Product Regulatory Compliance .....................................................................................15
2.6 Reliability Specifications ................................................................................................ 16
2.7 Temperature Sensor ..................................................................................................... 16
2.8 Power Loss Capacitor Test ............................................................................................. 16
2.9 Hot Plug Support ......................................................................................................... 17
2.10 Out of Band Management (SMBUS) ................................................................................ 17
2.11 Variable Sector Size Support ......................................................................................... 17
3 Mechanical Information ................................................................................................18
4 Pin and Signal Descriptions ........................................................................................... 20
4.1 2.5-inch Form Factor Pin Locations ................................................................................. 20
4.2 Pin Signal Definitions .................................................................................................... 20
5 Supported Command Sets ............................................................................................23
5.1 NVMe* Admin Command Set ......................................................................................... 23
5.2 NVMe* I/O Command Set ............................................................................................. 23
5.3 Log Page Support ........................................................................................................24
5.4 SMART Attributes ......................................................................................................... 24
5.5 Temperature Statistics . ................................................................................................ 27
5.6 Drive Marketing Name Log ............................................................................................ 27
5.7 SET Feature Identifiers ................................................................................................. 27
6 NVMe* Driver Support .................................................................................................. 29
7 Certifications and Declarations ....................................................................................... 30
Appendix A IDENTIFY Data Structure ................................................................................. 31
Appendix B Vital Data Structure ........................................................................................38
Appendix C Out of Band Temperature Sensor Read Out ........................................................39
Appendix D PCIe* ID ........................................................................................................ 40
Appendix E SCSI Command Translati on .............................................................................. 41
Appendix F Add-in Card LED Decoder ................................................................................. 42

Produktspecifikationer

Varumärke: Intel
Kategori: Solid State-enheter (ssd)
Modell: DCP3600

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