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Intel® Pentium® D Processor 800Δ
Sequence
Datasheet
– On 90 nm Process in the 775-land LGA Package and supporting
Intel® Extended Memory 64 TechnologyΦ
February 2006
Document Number: 307506-003
2Datasheet
Contents
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Pentium® D processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across
different processor families. Over time processor numbers will increment based on changes in clock speed, cache, FSB, or other features, and
increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See http://www.intel.com/products/processor_number for details.
ΦIntel® Extended Memory 64 Technology (Intel® EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device
drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.
Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including
details on which processors support EM64T or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system.
Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Intel Xeon, Intel NetBurst, Intel SpeedStep and the Intel logo are trademarks or registered trademarks of Intel Corporation or its
subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005–2006 Intel Corporation.
Datasheet 3
Contents
Contents
1 Introduction....................................................................................................................................11
1.1 Terminology ........................................................................................................................12
1.1.1 Processor Packaging Terminology ........................................................................12
1.2 References .........................................................................................................................13
2 Electrical Specifications.................................................................................................................15
2.1 Power and Ground Lands...................................................................................................15
2.2 Decoupling Guidelines........................................................................................................15
2.2.1 VCC Decoupling ....................................................................................................15
2.2.2 VTT Decoupling.....................................................................................................15
2.2.3 FSB Decoupling.....................................................................................................16
2.3 Voltage Identification ..........................................................................................................16
2.4 Reserved, Unused, FC and TESTHI Signals......................................................................18
2.5 Voltage and Current Specifications ....................................................................................19
2.5.1 Absolute Maximum and Minimum Ratings.............................................................19
2.5.2 DC Voltage and Current Specifications .................................................................19
2.5.3 VCC Overshoot Specification ................................................................................25
2.5.4 Die Voltage Validation ...........................................................................................26
2.6 Signaling Specifications......................................................................................................26
2.6.1 FSB Signal Groups ................................................................................................26
2.6.2 GTL+ Asynchronous Signals .................................................................................28
2.6.3 FSB DC Specifications ..........................................................................................29
2.7 Clock Specifications............................................................................................................32
2.7.1 FSB Clock (BCLK[1:0]) and Processor Clocking...................................................32
2.7.2 FSB Frequency Select Signals ..............................................................................32
2.7.3 Phase Lock Loop (PLL) and Filter .........................................................................33
3 Package Mechanical Specifications ..............................................................................................35
3.1 Package Mechanical Drawing ............................................................................................35
3.2 Processor Component Keep-Out Zones.............................................................................39
3.3 Package Loading Specifications.........................................................................................39
3.4 Package Handling Guidelines.............................................................................................39
3.5 Package Insertion Specifications........................................................................................40
3.6 Processor Mass Specification.............................................................................................40
3.7 Processor Materials ............................................................................................................40
3.8 Processor Markings ............................................................................................................40
3.9 Processor Land Coordinates ..............................................................................................42
4 Land Listing and Signal Descriptions ............................................................................................43
4.1 Processor Land Assignments .............................................................................................43
4.2 Alphabetical Signals Reference..........................................................................................66
5 Thermal Specifications and Design Considerations ......................................................................75
5.1 Processor Thermal Specifications ......................................................................................75
5.1.1 Thermal Specifications ..........................................................................................75
5.1.2 Thermal Metrology.................................................................................................79
Produktspecifikationer
| Varumärke: | Intel |
| Kategori: | Processor |
| Modell: | Pentium D 840 |
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