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VSC8512

Application Note

VSC8512 Design Guide

VPPD-01611 VSC8512 Application Note Revision 1.0

Contents

1 Revision History 1.0 ....................................................................................................................... 1

1.1 Revision 1.0 ........................................................................................................................................

2 Introduction ................................................................................................................................... 2

2.1 References .........................................................................................................................................

2.1.1 Vitesse Documents .................................................................................................................................. 2

2.1.2 IEEE Standards ......................................................................................................................................... 2

2.1.3 External Documents ................................................................................................................................ 2

3 Key Item Checklist .......................................................................................................................... 3

4 Design Aids ..................................................................................................................................... 4

4.1 Reference Design ................................................................................................................................

4.2 IBIS Model ..........................................................................................................................................

4.3 BSDL File .............................................................................................................................................

4.4 OrCAD Symbol ....................................................................................................................................

5 Copper Magnetics Modules ........................................................................................................... 5

5.1 Return Loss Parameter ....................................................................................................................... 5

5.2 Secondary Magnetics Parameters ...................................................................................................... 5

6 EMI Management .......................................................................................................................... 6

6.1 PHY EMI testing ..................................................................................................................................

6.2 MAC Interface Design Keys .................................................................................................................

6.3 Copper Interface Design Keys .............................................................................................................

6.4 Grounding Considerations ..................................................................................................................

6.4.1 Ground Isolation ...................................................................................................................................... 6

6.5 Bob Smith Termination .......................................................................................................................

7 Power Supply Considerations ........................................................................................................ 9

7.1 Power Supply Planes ..........................................................................................................................

7.2 Analog Power Plane Filtering .............................................................................................................. 9

7.3 Local Decoupling .................................................................................................................................

7.4 Power Supply and Clock Sequencing ................................................................................................ 10

7.5 Power Supply Estimated Requirements ........................................................................................... 10

8 Thermal Considerations ............................................................................................................... 11

8.1 Heat Removal from Device ............................................................................................................... 11

8.2 Temperature Measurement ............................................................................................................. 12

8.2.1 Temperature Diode Options ................................................................................................................. 12

9 Copper Interface .......................................................................................................................... 13

9.1 Layout Considerations ...................................................................................................................... 13

VSC8512 Design Guide

VPPD-01611 VSC8512 Application Note Revision 1.0

9.2 Using PHYs in Backplane Applications .............................................................................................. 13

9.3 Surge Protection ............................................................................................................................... 14

9.4 PHY Miscellaneous ........................................................................................................................... 14

10 MAC Interfaces ........................................................................................................................... 15

10.1 QSGMII Interface ............................................................................................................................ 1

10.2 SGMII/SerDes Interface .................................................................................................................. 15

10.3 Design Rules ................................................................................................................................... 1

10.4 AC Coupling Capacitors .................................................................................................................. 16

10.5 SerDes Media ................................................................................................................................. 1

10.5.1 Unidirectional for Streaming ............................................................................................................... 16

11 Miscellaneous Design Considerations ........................................................................................ 17

11.1 SMI (MDC/MDIO) Device Address .................................................................................................. 17

11.2 REF_FILT / REF_REXT Pins ............................................................................................................... 17

11.3 Device Clock Input .......................................................................................................................... 1

11.3.1 Clock Power Supply Filtering ............................................................................................................... 18

11.4 COMA_MODE ................................................................................................................................. 1

11.5 CLKOUT Pin ..................................................................................................................................... 1

11.6 Serial Management Interface (SMI) ............................................................................................... 18

11.7 JTAG (Boundary Scan) Design ......................................................................................................... 19

11.7.1 JTAG Interface “Never” Used .............................................................................................................. 19

11.7.2 JTAG Interface Used In Board Design .................................................................................................. 19

11.7.3 AC-JTAG ............................................................................................................................................... 19

11.8 LEDs ................................................................................................................................................ 1

11.8.1 Dual LED per Port Option .................................................................................................................... 20

11.8.2 Serial LED Option ................................................................................................................................. 20

11.8.3 Adjustable Brightness LED ................................................................................................................... 20

11.9 GPIO and Multi Mode Pins ............................................................................................................. 20

11.9.1 Fast Link Failure ................................................................................................................................... 20

11.10 CMODE Interface .......................................................................................................................... 20

11.11 SyncE Support ............................................................................................................................... 20

11.12 Controlling SFPs and Talking to I2C Devices ................................................................................. 20

11.13 Unused PHY Ports ......................................................................................................................... 2

12 Software Considerations ............................................................................................................. 22

12.1 Resources ....................................................................................................................................... 2

12.2 Configuration .................................................................................................................................. 2

12.3 Minimum Register Configuration ................................................................................................... 22

12.4 Power Management Software Features ......................................................................................... 22

12.4.1 EEE ....................................................................................................................................................... 22

12.4.2 ActiPHY ................................................................................................................................................ 22

12.4.3 PerfectReach ....................................................................................................................................... 22