Electro-Voice XGS-3 Bruksanvisning

Electro-Voice Inte kategoriserad XGS-3

Läs nedan 📖 manual på svenska för Electro-Voice XGS-3 (2 sidor) i kategorin Inte kategoriserad. Denna guide var användbar för 11 personer och betygsatt med 4.5 stjärnor i genomsnitt av 2 användare

Ladda ner PDF

Sida 1/2

XGS-3 Groundstack

The X-Line Compact Groundstack features a rigging attachment position to allow a column of an X-Line Compact

Loudspeaker Array to be Groundstacked and tilted to obtain the desired sound coverage.

X-Line Compact

XGS-3 Groundstack

User Instructions

Figure 1: Attaching Loudspeakers to Groundstack Rails

Note: Assembly process is

mirrored for the other side.

To select the correct pin position on the bottom enclo-

sure of your XLC Ground Stack, find your enclosure

type and specific angle, and pin the Ground Stack

swing arm to that position. For safety reasons, pin

only to numerically indicated positions. Left sides are

shown, right are mirrored views.

Figure 2: Angle Instruction for Bottom Enclosure

Pin Position

Quick-Release Pin

(From Enclosure)

Button Bar

(Push in through access hole)

XLC Loudspeaker Lag Bolt Holes

(2 per side)

U.S.A. and Canada only. For customer orders,

contact the Customer Service department at

800/392-3497 Fax: 800/955-6831

Europe, Africa and Middle East only. For customer orders,

contact the Customer Service department at

49 9421-706 0 Fax: 49 9421-706 265

For warranty information, contact the Service Repair department at:

616/695-6831 or 800/685-2606

For technical assistance, contact Technical Support at:

866/78AUDIO

Specifications subject to change without notice.

12000 Portland Avenue South, Burnsville, MN 55337

Phone: 952/884-4051, Fax: 952/884-0043

www.electrovoice.com

Part Number 38110-464 Rev A

Figure 3: Full-Range Array -

XLC127+ Array (8 Max)

Figure 4: Subwoofer Array -

XLC118 or XLC215 Array (5 Max)

Figure 5: Combination Array -

XLC127+ (5 Max) and

XLC118/XLC215 (2 Max)

These configurations are showing

the maximum number of enclo-

sures and top enclosure angles

allowed. They also show the

proper balance for safety and

acoustical performance. All lesser configura-

tions are allowed at customer’s discretion.

For all configurations approaching these

maximums, and all configurations used

outdoors, use the lag bolt holes in the base of

the L-extrusions to secure the groundstack

base to the mating surface.

Produktspecifikationer

Varumärke:	Electro-Voice
Kategori:	Inte kategoriserad
Modell:	XGS-3
Bredd:	244 mm
Djup:	244 mm
Användarmanual:	Ja
Ethernet LAN:	Ja
Maximal upplösning:	4096 x 2160 Pixels
Medföljande kablar:	SATA
Antal USB 2.0-portar:	2
Antal HDMI-portar:	1
Mikrofon, linjeingång:	Ja
Antal Ethernet LAN (RJ-45)-portar:	1
Hörlursutgångar:	1
DVI-D-portar:	1
Stöder Windows:	Windows 10
Antal portar USB 3.2 Gen 1 (3.1 Gen 1) Typ A:	2
Processoruttag:	LGA 1151 (Socket H4)
Processorfabrikant:	Intel
Maximalt internminne:	64 GB
Intel® Turbo Boost-teknik:	2.0
Intel® Quick Sync-videoteknik:	Ja
Intel® InTru™ 3D-teknik:	Ja
Intel® Clear Video HD-teknik (Intel® CVT HD):	Ja
Intel® Insider™:	Ja
Ljudutgångskanaler:	7.1 kanalen
Antal portar USB 3.2 Gen 1 (3.1 Gen 1) Typ C:	1
Ethernet-gränssnittstyp:	Gigabit Ethernet
Chipset moderkort:	Intel® Z370
Typ av minnesplats:	DIMM
Minneskanal:	Dubbelkanaals
PCI Express x16 (Gen 3.x)-platser:	2
PCI Express x1 (Gen 3.x)-platser:	2
Intel® Optane™ Memory Ready:	Ja
PS/2-port(ar):	2
Komponent för:	PC
LAN-kontroller:	Intel® I219-V
Typer av RAID:	0, 1,5, 10
Maximalt minne grafikadapter:	1024 MB
Antal SATA III-kontakter:	4
Kompatibla processorer:	Intel Celeron, Intel Pentium
Minnestyper som stöds:	DDR4-SDRAM
Moderkort chipset familj:	Intel
Moderkorts formfaktor:	micro ATX
Antal minnesplatser:	4
Minnesklockhastigheter som stöds:	2133,2400,2666,2800,3000,3200,3300,3333,3400,3466,3600,3733,3866,4000 MHz
BIOS-typ:	UEFI AMI
BIOS-minnesstorlek:	16 Mbit
ACPI-version:	6.1
Stöd för parallell bearbetning:	CrossFireX
COM-anslutningar:	1
Anslutning för CPU-kylare:	Ja
Anslutningar för husfläktar:	2
ATX-strömkontakt (24-stift):	Ja
Frontpanelkontakt:	Ja
USB 2.0-anslutningar:	2
Obuffrat minne:	Ja
USB 3.2 Gen 1 (3.1 Gen 1) anslutningar:	2
EPS-strömkontakt (8-stift):	Ja
Rensa CMOS-bygel:	Ja
Intel® Extreme Memory Profile (XMP):	Ja
Antal M.2 (M) platser:	2